Mechanical Devices - is a global leader and innovator in IC temperature forcing systems /solutions / temperature systems, that are used primarily by semiconductor
manufacturers to test their IC and wafer.
Mechanical Devices IC thermal control units perform
fast, accurate, stable and cost effective solutions, using advanced and patented
With the industry´s state-of-the-art benchtop temperature
control systems Flex TC and high power Max TC, Mechanical Devices is changing the way of
testing and thermal cycling of DUT´s, enabling semiconductor manufacturers
to increase their own profitability by improving the efficiency of their IC and
wafer test processes.
Mechanical Devices end-user customers are among the world’s top
semiconductor manufacturers. Our systems are well integrated with automatic
test equipment (ATE) and Handler in production.
The FlexTC Benchtop Temperature Forcing Test System is a
technological breakthrough in DUT cooling and heating technology. FlexTC covers
a wide temperature range of -55°C to +155°C with an accuracy of +/- 0.2°C. It
is compact, self-contained, fluid-free and easily fits on a bench-top. FlexTC
does not require compressed air or chillers and has ultra-quiet operation (40d
The MaxTC Premium Thermal Forcing Test System is our latest product and a powerful evolution of the FlexTC, containing
all the benefits of the former but with increased temperature range of -65°C to
+175°C/ +200°C, enhanced transfer rates (120°C/min) and powerful cooling force. MaxTC
provides solutions for all cooling and heating needs in the semiconductor
Mechanical Devices Temperature Test Systems are proven for environmental test assure quality and help with failure analysis by environmental stressing the device throughout the semiconductor product design and manufacturing back end test.These Products include and are protected by pending patents.
Proprietary of Mechanical-Devices Ltd 2012©
and ISO 9001:2008 Certified.
Among our customers:
Intel, Marvell, Analog, Microsemi, Microsoft, Apple, Cadence, Dialog, ST, Broadcom, Sandisk, NXP, Qualcomm, Freescale, InvenSense, Cisco, Samsung. and many more...
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